Clearly using liquid threadlocker on any screwed bolted electrical connections is very bad and quite possibly illegal and unsafe too.
Electrically conductive adhesive loctite.
Loctite ablestik 57c features and benefits.
Loctite ablestik 59c features and benefits.
Loctite ablestik 59c silicone heat cure loctite ablestik 59c adhesive is designed for applications used at high temperatures which require electrical conductivity and do not need a high bond strength.
It can be used in its.
Loctite 3616 epoxy surface mount adhesive small parts bonding loctite 3616 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering.
Particularly suited to printing a range of dot heights with one stencil thickness and where high wet strength characteristics and high print speeds are required.
Loctite si 5421 silicone bonding or gasketing flexible formed in place electrically conductive adhesive loctite si 5421 is used for automotive sensor bonding and gasketing of emi rf shielded enclosures.
Ellsworth adhesives europe supplies electrically conductive adhesives from henkel loctite.
There is a conductive liquid product made by loctite but it is an epoxy adhesive not a threadlocker.
Loctite ablestik 57c epoxy assembly loctite ablestik 57c adhesive is designed to make electrical connections where hot soldering is impractical and room temperature cure is required.
I often hear people suggest using conductive loctite when what they really mean is.
Please refer to the tds for alternate cure.
Loctite ablestik qmi3555 incorporates a patented silver vanadium glass at a metal to glass ratio of 6 5 1 by weight.
Loctite ablestik 2151 is a thixotropic two part adhesive that develops strong durable high impact bonds at room temperature improving heat transfer while maintaining electrical insulation.
Industry leading loctite ablestik die attach adhesives are highly conductive metal filled adhesives with excellent electrical conductivity dispensability and high reliability performance designed to mee the rquirements of today s challenging high density die architectures.
In this digital era with our extensive use of electronic devices the requirement for electrically conductive adhesives has risen significantly.