Electronic Ceramic Substrate

Substrates electronic circuit carriers made from advanced ceramic materials rubalit and alunit engineered by ceramtec have earned a reputation worldwide as the standard materials for electronic circuit carriers and their quality is acknowledged by every brand name manufacturer of hybrid circuits.

Electronic ceramic substrate.

The ceramic substrate material is widely used in electronic packaging substrate for its advantages such as high strength good insulation good thermal conductivity and heat resistance small thermal expansion coefficient and good chemical stability. The advantages of alumina include high resistivity good mechanical and dielectric strength excellent thermal and corrosion stability and the ability to provide hermetic seals. A second fabricates it into a ceramic component e g a capacitor or ceramic substrate while a third integrates it onto an electronic subassembly such as a printed circuit board pcb. The role of the substrate in power electronics is to provide the interconnections to form an electric circuit like a printed circuit board and to cool the components.

The substrate has the advantages of small volume good heat dissipation low thermal resistance and no pollution. Compared to materials and techniques used in lower power microelectronics these substrates must carry higher currents and provide a higher voltage isolation up to several thousand volts. Among the ceramics employed as electronic substrates and packages the dominant material is alumina aluminum oxide al 2 o 3.